FAQ
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Q : Does every display need the same reliability tests?
No. Tests follow the use environment. Outdoor and industrial products need more than indoor ones.
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Q : Which step has the biggest effect on yield?
The cell process. Gap control, sealing, and liquid crystal filling all happen here. That is why it gets sampling checks.
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Q : What is the difference between COG and COB in production?
COG bonds the driver IC onto the glass. COB mounts it on a PCB. COG gives a slimmer module. COB uses a PCB-based route.
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Q : What are the main stages of LCD manufacturing?
Three. Glass and cell, module assembly, then inspection and packaging. Large TFT fabs call the first part array and cell.
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Q : Which cell step affects display quality most?
The cell gap. Spacers and pressing control it. Gap changes alter contrast and uniformity.
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Q : How do you trace a defect back to its source?
Read the pattern. The same spot on every plate points to the photomask, lens, or nozzle. Random dots point to particles. Broken or bridged lines across a whole plate point to drifting exposure, development, or etching settings. Defects clustered at the edge point to the robot, stage, or air knife.
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Q : Can the display be tailored to my device?
Yes. Options include size, interface, backlight and touch integration. See the custom solutions page for the process.
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Q : Which interface suits high resolution panels?
LVDS is common for XGA and above. MIPI suits compact, dense modules. RGB suits smaller panels.