Newly Arrival COG LCD Display Modules for Hungary Manufacturer
COG LCD Display Modules(Chip-On-Glass) Chip-On-Glass (COG) is a flip chip bonding method which is used for connect assembly of bare integrated circuits (ICs) on glass substrate directly by using Anisotropic Conductive Film (ACF). The pitch of the IC bumps (footprint) can be scaled down according to customers’… COG LCD Display Modules(Chip-On-Glass) Chip-On-Glass (COG LCD Display Modules) is a flip chip bonding method which is used for connect assembly of bare integrated circuits (...
Newly Arrival COG LCD Display Modules for Hungary Manufacturer Detail:
COG LCD Display Modules(Chip-On-Glass) Chip-On-Glass (COG) is a flip chip bonding method which is used for connect assembly of bare integrated circuits (ICs) on glass substrate directly by using Anisotropic Conductive Film (ACF). The pitch of the IC bumps (footprint) can be scaled down according to customers’…
COG LCD Display Modules(Chip-On-Glass)
Chip-On-Glass (COG LCD Display Modules) is a flip chip bonding method which is used for connect assembly of bare integrated circuits (ICs) on glass substrate directly by using Anisotropic Conductive Film (ACF). The pitch of the IC bumps (footprint) can be scaled down according to customers’ requirements (contact pitch of glass substrate). This method reduces the assembly area to the highest possible packing density, which especially important to those applications that space saving is crucial. It allows a cost-effective mounting of driver chips because integrating flex PCB is no longer required. The IC is bonded directly onto the glass substrate and is suitable for handling high-speed or high-frequency signals.
COG LCD Display Modules technology is one of the high-tech mounting methods which use Gold Bump or Flip Chip IC’s, and implemented in most compact applications. Chip-On-Glass integrated circuits were first introduced by Epson. In flip-chip mounting, the IC chip is not packaged but is mounted directly onto the PCB as a bare chip. Because there is no package, the mounted footprint of the IC can be minimized, along with the required size of the PCB. This technology reduces the mounting area and is better suited to handling high-speed or high frequency signals.
COG is primarily used for source driver ICs within TFT display technologies where they are used for LCD, plasma, e-ink, OLED or 3D technologies. This is essential for consumer electronic products such as notebooks, tablets, cameras or mobile phones with the need for small size and light-weight components.
Very economical on size. Chip-On-Glass LCD modules can be as thin as 2 mm.
Cost effective over COB, especially in graphic LCD modules, because reduces the number of IC’s.
More reliable than TAB due to TAB’s weakness in the bond area.
COG can only be used at a certain resolution level where the lines are not too fine. At very fine pitches COG becomes difficult to test, and TAB would be the preferred approach.
It may be more cost-effective to use TAB or COB, if a designer has to integrate a keypad or indicator around the display.
The active area is not centered within the outline but offset, because of the area where the circuits are.
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We always think and practice corresponding to the change of circumstance, and grow up. We aim at the achievement of a richer mind and body and the living for Newly Arrival COG LCD Display Modules for Hungary Manufacturer, The product will supply to all over the world, such as: Nigeria , Lesotho , Slovakia , we sincerely hope to establish a good and long-term business relationship with your esteemed company through this opportunity, based on equality, mutual benefit and win-win business from now to the future. "Your satisfaction is our happiness".
See a Raspberry Pi constructed from scratch. From start to finish we show the manufacturing process of the Raspberry Pi at the Sony facility in Pencoed South Wales: assembly, inspection and testing. Claire Doyle, Head of Raspberry Pi Global Division at Element 14, and Gareth Jones, Senior Manager New Business Development at Sony Uk Tech, talk us through the process. For more on the Raspberry Pi see http://www.electronicsweekly.com/raspberry-pi-development/
Camera and production: David Berman. Copyright: Metropolis Multimedia
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Lahti 20mm Anti Tank Rifle vs iMac
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The Lahti L-39 is a Finnish 20 mm anti-tank rifle used during the Second World War. It had excellent accuracy, penetration and range, but its size made transportation difficult. It was nicknamed “Norsupyssy” (“Elephant Gun”), and as tanks developed armour too thick to be penetrated by even this large, powerful rifle, its uses switched to long range sniping, tank harassment and with the L-39/44 fully automatic variant, an improvised anti-aircraft weapon.
The rifle is a semi-automatic, gas operated weapon with the piston located beneath the barrel and ammunition feed from detachable top-mounted magazine with bottom ejection for the spent cartridges. To reduce recoil, the rifle is equipped with a five hole muzzle brake and a padded leather recoil pad.
The iMac is a range of all-in-one Macintosh desktop computers designed and built by Apple Inc. It has been the primary part of Apple’s consumer desktop offerings since its introduction in 1998-08 (shipped; intro 1998-05), and has evolved through six distinct forms.
In its original form, the iMac G3 had a gum-drop or egg-shaped look, with a CRT monitor, mainly enclosed by a colored, translucent plastic case, which was refreshed early on with a sleeker design notable for its slot-loaded optical drive. The second major revision, the iMac G4, moved the design to a hemispherical base containing all the main components and an LCD monitor on a freely moving arm attached to it. The third and fourth major revisions, the iMac G5 and the Intel iMac respectively, placed all the components immediately behind the display, creating a slim unified design that tilts only up and down on a simple metal base. The fifth major revision shared the same form as the previous model, but was thinner and used anodized aluminum and a glass panel over the entire front. The newest iMac uses a different display unit, omits the SuperDrive, and uses different production techniques from the older unibody versions. This allows it to be thinner at the edge than older models, with an edge thickness of 5.9mm (but the same maximum depth). It also includes a dual microphone setup, and includes SSD or HDD storage, or an Apple Fusion Drive, a hybrid of solid state and hard disk drives. The latest model was announced on October 23, 2012, with the 21.5″ version released on November 30 and the 27″ version released in December; these were refreshed on September 24, 2013, with new Haswell processors, faster graphics, faster and larger SSD options and 802.11ac WiFi cards.
By Cherry from Estonia - 2016.02.14 13:19
The factory workers have rich industry knowledge and operational experience, we learned a lot in working with them,we are extremely grateful that we can encount a good company has excellent wokers.
By Nicole from Chile - 2015.06.30 17:29